| 摘要 |
A semiconductor package structure relates to a chip-embedded semiconductor package electrically connected to a second semiconductor component. The semiconductor package structure comprises a first packaging substrate having a first surface, a second surface and at least a first cavity penetrating through the first surface and the second surface. The semiconductor package structure includes a first semiconductor component with electrode pads disposed in the first cavity. A first build-up circuit structure comprising a plurality of third and fourth conductive pads, and a second semiconductor component with electrode pads is disposed on surfaces of the third conductive pads by a first conductive element. The semiconductor package structure also includes a second conductive element disposed on the fourth conductive pads of the first build-up circuit structure of the first packaging substrate and a stacked structure electrically connecting the stacked structure to the first build-up circuit structure disposed on the first packaging substrate.
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