| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device by which both rearranged wiring and connections formed as projecting electrodes can be formed in a simple manufacturing process, and to provide a semiconductor device manufactured by the method and a circuit board and electronic equipment equipped with the semiconductor device. <P>SOLUTION: After a stress-relieving layer 26 is formed on a substrate 10 and, in addition, holes used for partially burying connecting terminals 24 in the substrate 10 are formed into the substrate 10, a foundation film 22 is formed on the upper surface of the substrate 10 and, thereafter, the connecting terminals 24 and rearranged wiring 32 are successively formed in this order. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p> |
