发明名称 LED device, method of manufacturing the same, and light-emitting apparatus
摘要 The LED device (27) has a LED bare chip (25) mounted directly on a metal contact (28), and supplies power to the bare chip and conducts heat from the bare chip via the metal contact.
申请公布号 US9425372(B2) 申请公布日期 2016.08.23
申请号 US201113521294 申请日期 2011.01.18
申请人 Japan Aviation Electronics Industry, Limited 发明人 Kanno Hideyuki
分类号 H01L29/06;H01L21/44;H01L33/64;H05K3/32;H01L25/075;H01L33/48;H01L33/62;H05K1/02;H05K3/30;F21K99/00;F21V7/05;F21V17/12;F21Y101/02;F21Y103/02;F21Y105/00 主分类号 H01L29/06
代理机构 Collard & Roe, P.C. 代理人 Collard & Roe, P.C.
主权项 1. An LED device to be connected to a socket connector, comprising: a device body made of plastic and having a first surface and a second surface opposite to the first surface; a plurality of metal contacts insert-molded in the device body and each having a first end portion placed on the first surface and a second end portion opposite to the first end portion; and a plurality of LED bare chips mounted directly on the first end portions of the metal contacts, respectively, wherein the second end portions of the metal contacts protrude outward of the device body from the second surface, thereby forming terminal portions each of which has a plate shape perpendicular to the second surface, wherein each of the terminal portions extends lengthily along the second surface to fit snugly with an elongated socket of the socket connector, and wherein power supply to the LED bare chips and heat radiation from the LED bare chips are carried out through the metal contacts.
地址 Tokyo JP
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