| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an X-ray detector suppressing the characteristics degradation due to thermal expansion. <P>SOLUTION: A metal plate 25, whose thermal expansion coefficient difference from an X-ray photoconductor layer 4 is smaller than that from the X-ray photoconductor layer 4 and a TFT circuit board 3, is jointed to the opposite side of the TFT circuit board 3 to the X-ray photoconductor layer 4. Stress by the thermal expansion coefficient difference on the interface between the X-ray photoconductor layer 4 and a TFT circuit board 3 side that is generated by temperature variations during use, after manufacturing, or during storage of the X-ray detector is suppressed, breakage of a retain substrate 11 constituting the TFT circuit board 3, the characteristics variations of the X-ray photoconductor layer 4, and breakage by crack occurrence can be suppressed, and the characteristics degradation due to thermal expansion can be suppressed. <P>COPYRIGHT: (C)2007,JPO&INPIT |
