| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of preventing a thin film resin substrate from being warped when underfill resin is hardened, and to provide its manufacturing method. SOLUTION: The semiconductor device is equipped with the thin film resin substrate, a semiconductor chip mounted on the thin film resin substrate through a conductive joint, and a support plate that is bonded to the semiconductor chip through a first adhesive joint and bonded to the thin film resin substrate through a second adhesive joint, and the conductive joint is sealed with the underfill resin. The support plate of the semiconductor device has a through-hole filled with the underfill resin. The method of manufacturing the semiconductor device is provided. COPYRIGHT: (C)2007,JPO&INPIT |
