| 摘要 |
PROBLEM TO BE SOLVED: To provide a device and a method for replacing an electronic component that are adaptive to both a small component to be replaced and high-density mounting. SOLUTION: The device 100 for replacing the electronic component comprises a heating nozzle 6 which jets a hot blast 7 to the electronic component 2 to be replaced which is mounted on a circuit board 1, a suction nozzle 5 which sucks the electronic component 2 to be replaced, and a heat shielding cover 4 which covers the top and flank of a peripheral electronic component 3 fitted onto a peripheral circuit board. COPYRIGHT: (C)2007,JPO&INPIT
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