| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer inspecting probe card capable of attaining surely required electric connection even in a wafer having a large number of inspected electrodes with a wide area and a small size, capable of measuring surely resistance highly precisely, and manufactured at a low cost; and also to provide an wafer inspection device and a method using the same. SOLUTION: This wafer inspecting probe card has the first electrode sheet, the first anisotropic conductive sheet arranged on a surface thereof, the second anisotropic conductive sheet arranged on a reverse face of the first electrode sheet and formed with a through hole corresponding to an inspected electrode, and the second electrode sheet arranged on a reverse face thereof. The first electrode sheet has a flexible insulating sheet formed with a through hole corresponding to the each inspected electrode, a plurality of ringlike electrodes formed to surround the through hole on a surface of the insulating sheet, and relay electrodes formed on a reverse face of the insulating sheet. The second electrode sheet has a plurality of inspecting core electrodes arranged corresponding to the inspected electrodes, and a plurality of connecting core electrodes arranged corresponding to the relay electrodes. COPYRIGHT: (C)2007,JPO&INPIT
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