发明名称 ELECTRONIC COMPONENT MOUNTING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide an automatic electronic component mounting apparatus capable of shortening mounting time per one electronic component as much as possible, by causing up-and-down motion and simultaneous horizontal motion of an suction nozzle to start as quickly as possible, based on a delay in the startup of a hoisting mechanism of the suction nozzle or a horizontal axis. <P>SOLUTION: During descent of the suction nozzle 15, a CPU decides the position where the nozzle 15 in motion starts descending, based on the startup delay time of the nozzle hoisting motor 51 for hoisting the nozzle 15 stored in a RAM, in other words the time (delay in the startup of an NL axis) since the CPU outputs a signal instructing the hoisting motor 51 to start operation till the hoisting motor 51 actually starts operation, and the time until the nozzle 15 arrives at a place where it absorbs the electronic component with the descending speed after starting descending. Therefore, it is possible to expedite the time as much as possible when the nozzle 15 starts descending while a placement head 16 is in motion, or while the nozzle 15 is in motion. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007096238(A) 申请公布日期 2007.04.12
申请号 JP20050287152 申请日期 2005.09.30
申请人 HITACHI HIGH-TECH INSTRUMENTS CO LTD 发明人 KAIZUMI KAZUYOSHI;KAMEDA MAKIO;FUKUSHIMA YOSHIHARU;KASHIWATANI NAOKATSU
分类号 H05K13/04 主分类号 H05K13/04
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