| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic device improved in air flow for cooling, without increase in pressure loss in the upper part of a back board substrate and a support plate of the back board substrate. <P>SOLUTION: The electronic device is provided with a chassis 101 equipped with an air inlet 111 for cooling at one end, and a cooling fan 110 for exhaust gas at the other end; two or more first mounting substrates 103 wherein two or more electronic components 102 are mounted inside the above chassis 101 at the side of the air inlet 111; and two or more second mounting substrates 104 at the side of the cooling fan 110 for exhaust gas. The device forms: a back board substrate 105 for connecting the two or more first mounting substrate 103 and the two or more second mounting substrate 104; a support plate 112 for fixing the back board substrate 105; and an exhaust duct for leading the air for cooling to the cooling fan 110 for an exhaust gas between the support plate 112 and the chassis 101, and is provided with ventilation guides 115 each having a predetermined inclination, in the two or more first mounting substrates 103, respectively. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
