| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface-mounted electronic circuit unit which is compact and has good productivity and small thermal stress to an electronic component, and its fitting method. SOLUTION: The surface-mounted electronic circuit unit is improved in productivity since a cover 5 need not be soldered to be fitted since legs 5c are inserted into through-holes 1a bored in an insulating substrate 1 where an electronic component 4 is mounted from a top-surface side and locked by locks 5d in the through-holes 1a, and the locks 5c come into contact with ground electrodes 3 provided in the through-holes 1a and then can be grounded to a motherboard 6 at the positions of the ground electrodes 3 in the through-holes 1a to make the insulating substrate 1 smaller than before, thereby making the surface-mounted type electronic circuit unit compact. COPYRIGHT: (C)2007,JPO&INPIT
|
