发明名称 |
IMAGE SENSOR MODULE, CAMERA MODULE USING THE SAME AND MANUFACTURING METHOD OF CAMERA MODULE |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide the image sensor module which minimizes a tolerance generated by a package method to prevent an optical axis distortion (tilt and rotation) phenomenon, and also to provide a camera module using the same, and a manufacturing method of the camera module. <P>SOLUTION: The manufacturing method of the camera module comprises steps of: attaching an image sensor 33 which has a substantially same size as a width a of a FPCB 31 with a window 32 on a rear surface of the FPCB so as to provide an image sensor module 30; and coupling and attaching the image sensor module to the inner peripheral surface of a lower opening of a housing 20 supporting a lens section 10 from a direction opposite to the rear surface of the FPCB having the image sensor attached thereon, wherein an outer peripheral surface of the image sensor is used as a guide surface when the above coupling is performed. <P>COPYRIGHT: (C)2007,JPO&INPIT |
申请公布号 |
JP2007097159(A) |
申请公布日期 |
2007.04.12 |
申请号 |
JP20060235854 |
申请日期 |
2006.08.31 |
申请人 |
SAMSUNG ELECTRO MECH CO LTD |
发明人 |
KIM HO KYOUM;KWAK HYUNG CHAN;SHIN DONG MIN |
分类号 |
H04N5/225;H01L27/14;H04N5/335;H04N5/369 |
主分类号 |
H04N5/225 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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