| 摘要 |
PROBLEM TO BE SOLVED: To provide a chip resistor with an improved reliability by increasing the exfoliation resistance of a plating layer with respect to a surface electrode overlapping both ends of a resistor. SOLUTION: The chip resistor 10 has such a structure that the resistor 12, the surface electrode 13 overlapping both ends of the resistor 12, and a protection layer 14 for covering the resistor 12, are formed on top face of a rectangular-parallelepiped ceramic substrate 11; and that end face electrodes 18 airtightly joined to the surface electrode 13 are formed on both end faces in the longitudinal direction of the ceramic substrate 11. The surface electrode 13 is formed of a silver-based metal material, and the surface electrode 13 and the end face electrodes 18 are coated with the plating layer 19. The surface electrode 13 is formed by printing a paste for a thick film which is made by adding a small amount of carbon black powder to an organic solvent wherein the metal material of the surface electrode 13 is dispersed and then calcining it at a high temperature. In the surface layer of the surface electrode 13 after calcination, there are many voids 13a which the plating material can enter. COPYRIGHT: (C)2007,JPO&INPIT
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