| 摘要 |
PROBLEM TO BE SOLVED: To provide a connector-integrated device having improved reliability to damage. SOLUTION: The connector-integrated device 10 is formed by bonding a lead ceramic package 16 to a lead 14 fixed to a connector 12 with a conductive paste 18. A bump 22 is formed to a leadless ceramic package 16, and a gold bump 22 is bonded to the lead 14 with the conductive paste 18. The conductive paste 18 is easily deformed in comparison with solder, and damage such as crack or the like is not easily generated even if difference of thermal expansion is large between the leadless ceramic package 16 and lead 14. Moreover, thickness of the conductive paste 18 can be remarkably increased with the gold bump 22 formed to the leadless ceramic package 16. COPYRIGHT: (C)2007,JPO&INPIT
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