| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that a wiring board curves when underfill resin is heated to be cured during flip-chip bonding between a semiconductor chip and the wiring board. SOLUTION: The method of manufacturing a semiconductor device includes a connection step of connecting a conductor bump 7 formed on a semiconductor chip 8 to a conductive pad 9 formed on a wiring board 5 which corresponds thereto, a fixing step of fixing the wiring board 5 on a vacuum suction tool 1 through vacuum suction, a resin injection step of injecting the underfill resin 7 between the semiconductor chip 8 and the wiring board 5 below it, and a resin curing step of heating the underfill resin 7 to cure it. COPYRIGHT: (C)2007,JPO&INPIT |
