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发明名称
MANUFACTURING METHOD OF PRINTED CIRCUIT BOARD USING CU FILL PLATING
摘要
申请公布号
KR20070037859(A)
申请公布日期
2007.04.09
申请号
KR20050092974
申请日期
2005.10.04
申请人
SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人
YEO, JONG KI;KIM, KI HONG
分类号
H05K3/46;H05K3/40
主分类号
H05K3/46
代理机构
代理人
主权项
地址
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