| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device capable of preventing warpage of a lead frame or the like occurring after molding. SOLUTION: The manufacturing method of the semiconductor device includes steps of mounting a plurality of semiconductor chips on the lead frame 11, forming a package 13 by molding the semiconductor chips with a molding resin, and dividing the lead frame 11 into a plurality of semiconductor devices. An outer edge runner 15 is formed of a hot-formable resin along an outer rim of the lead frame 11. Thus, stress occurring by the formation of the package 13 is balanced with stress occurring by the formation of the outer edge runner 15, resulting in no warpage. COPYRIGHT: (C)2007,JPO&INPIT
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