| 摘要 |
PROBLEM TO BE SOLVED: To provide a laminate which becomes highly thermally conductive by a same usage applicable to a routine wiring board without establishing continuity between both surfaces of a substrate, and a wiring board using the laminate. SOLUTION: This laminate is obtained by thermally molding under pressure, a prepreg layer which remains semi-cured through impregnating a sheet-like fiber base material with a heat-curable resin, and a copper foil or a copper sheet arranged on both sides of the prepreg layer, into one piece. In a resin-insulating layer 2 formed by thermally molding the prepreg layer under pressure, a first heat-conducting member 3 formed, in a non-through state, from one surface to the other surface and a second heat-conducting member 3 formed, in a non-through state, from the other surface to the one surface, are alternately arranged. In addition, the first heat-conducting member 3 and the second heat-conducting member 3' are arranged in such a way that the interval between the centers of both members 3 and 3' is larger than the diameter of the heat-conducting member +0.02 mm and that the interval between the heat-conducting members left through the resin-insulating layer, is larger than 0.02 mm. COPYRIGHT: (C)2007,JPO&INPIT |
