| 摘要 |
PROBLEM TO BE SOLVED: To provide an etchant and an etching method capable of smoothing an etching process surface of a silicon substrate after etching. SOLUTION: The etchant used for wet-etching a silicon substrate is an alkaline solution added with gold (Au) of high concentration, more than 100ppb. The alkaline solution is KOH aqueous solution. COPYRIGHT: (C)2007,JPO&INPIT
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