发明名称 |
Verfahren zur Herstellung eines optoelektronischen Halbleiterbauteils mit optisch transparenter Abdeckung |
摘要 |
An optoelectronic semiconductor assembly includes at least the following components: a semiconductor chip with an optical sensor region on its active topside, a wiring substrate on which the semiconductor chip is arranged, electrical connecting elements extending between the semiconductor chip and the wiring substrate, and an optically transparent cover an optically transparent plastic encapsulation compound that embeds at least the semiconductor chip and electrical connecting elements. The optically transparent encapsulation compound can be formed via a compression molding process. |
申请公布号 |
DE102005023947(B4) |
申请公布日期 |
2007.04.05 |
申请号 |
DE20051023947 |
申请日期 |
2005.05.20 |
申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
FUERGUT, EDWARD;BEER, GOTTFRIED;BRUNNBAUER, MARKUS |
分类号 |
H01L31/0203;H01L31/0232;H01L31/18 |
主分类号 |
H01L31/0203 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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