发明名称 MANUFACTURING METHOD OF LED LUMINAIRE
摘要 <P>PROBLEM TO BE SOLVED: To provide a manufacturing method of an LED luminaire allowing a mounting board to be voidlessly fixed to a luminaire body and of suppressing deterioration of yield. <P>SOLUTION: In manufacturing the luminaire A, the mounting boards 20 are thermally pressure-bonded to a bottom wall 102 of a body 101 under vacuum decompression, thereafter LED chips 10 are mounted on the mounting boards 20 and the LED chips 10 are resin-sealed by a transparent resin material to form sealing parts 50. Next, a lens 60 is mounted on the upper side of each LED chip 50 and a dome-like color conversion member 70 is mounted on the mounting board 20 with an air layer formed between the sealing part 50 and the lens 60 to complete the assembly of each light emitting module 1. Thereafter, a wiring board 110 for electrically connecting a plurality of the light emitting modules 1 to one another is mounted in the body 101 to electrically connect the respective light emitting modules 1 to the wiring board 110 and thereafter a light distribution lens 104 is overlaid on an opening of the body 101. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007087669(A) 申请公布日期 2007.04.05
申请号 JP20050272881 申请日期 2005.09.20
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 URANO YOJI
分类号 F21V9/08;F21V5/04;F21V19/00;F21V29/00;F21Y101/02;H01L33/32;H01L33/50;H01L33/56;H01L33/58;H01L33/60;H01L33/62 主分类号 F21V9/08
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