发明名称 LAMINATE AND ELECTRIC CIRCUIT BOARD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a laminate capable of accurately manufacturing a capacity element having an excellent handling performance and a large electrostatic capacity, and an electric circuit board with the built-in capacity element using the laminate. <P>SOLUTION: The laminate has a dielectric layer, a first conductor layer formed on one surface of the dielectric layer, and a second conductor layer formed on the other surface of the dielectric layer. The first conductor layer is thinner than the second one in the laminate. The capacity element and a wiring can be manufactured accurately to the electric circuit board by using such a laminate. <P>COPYRIGHT: (C)2007,JPO&INPIT</p>
申请公布号 JP2007088130(A) 申请公布日期 2007.04.05
申请号 JP20050273490 申请日期 2005.09.21
申请人 TOPPAN PRINTING CO LTD 发明人 SATO JIN;KAWAMOTO KENJI;SEKINE HIDEKATSU
分类号 H05K1/16;H05K3/46 主分类号 H05K1/16
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