发明名称 Light-emitting diode component, comprises chip and terminals on support, covered by glass lens, with resin injection molded into interspace
摘要 <p>Positive and negative supply terminals (11) are mounted on a base (10). A light emitting diode (LED) chip (20) is mounted on a support surface (12) and connected to them (11). The lens assembly (30) combines a pressed glass lens and a light-transmitting hard resin layer; it (30) covers the support surface of the base. The hard layer fills the intervening space between lens and support surface. It encapsulates the LED chip (20) and bonds the glass lens and base by adhesion. Outer and inner optical surfaces of the pressed glass lens are convex and/or concave, corrugated or plane. The lens has a circular, rectangular, polygonal or asymmetrical outer frame and collar. Injection molding openings openings are provided in the LED assembly, especially in or at the edges of the outer frame. A notch in the frame and a projection of the base, form a secure catch connection at the upper edge of the base. The lens lies in contact with the base, being held on by the frame.</p>
申请公布号 DE202007001048(U1) 申请公布日期 2007.04.05
申请号 DE20072001048U 申请日期 2007.01.24
申请人 E-PIN OPTICAL INDUSTRY CO. LTD. 发明人
分类号 H01L25/075 主分类号 H01L25/075
代理机构 代理人
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