发明名称 MOLDING PANEL
摘要 PROBLEM TO BE SOLVED: To provide a molding panel which suppresses the occurrence of warpage and requiring no expensive mold. SOLUTION: Reinforcing fiber layers are formed at both sides of a core material and a pattern layer is arranged at one reinforcing fiber layer becoming the outside of the reinforcing fiber layers while a resin layer is arranged at the other reinforcing fiber layer to constitute the molding panel. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007083429(A) 申请公布日期 2007.04.05
申请号 JP20050271913 申请日期 2005.09.20
申请人 HITACHI HOUSETEC CO LTD 发明人 KANDA TAIJI;TAKADA KENJI;KUWANA YOICHI
分类号 B32B27/04;B29C43/20;B29K105/08;B29L9/00;B29L31/10;B32B3/12;B32B15/08 主分类号 B32B27/04
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