发明名称 RESIN COMPOSITION FOR MOLDING AND MOLDING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a resin-made ink discharge device for an ink-jet printer. SOLUTION: The ink discharge device for an ink-jet printer is manufactured from a thermosetting resin composition including 95-35 wt.% of a thermosetting resin and 5-65 wt.% of an organic filler having a particle size of≤10μm. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007083736(A) 申请公布日期 2007.04.05
申请号 JP20060351166 申请日期 2006.12.27
申请人 CLUSTER TECHNOLOGY CO LTD 发明人 ADACHI MINORU;UESUGI SHOJI
分类号 B41J2/16;B29C45/00;B29C45/26;C08L101/00 主分类号 B41J2/16
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