发明名称 CUTTING DEVICE, AND CUTTING METHOD
摘要 PROBLEM TO BE SOLVED: To improve the abrasion of a nozzle, and improve operation rates in a cutting device. SOLUTION: This cutting device comprising abrasive grains is provided with a high pressure pump 2, a first tank 5 connected to the high pressure pump 2 through first inflow side water system piping 4, a first inflow side on/off valve 30, and a first tank on/off valve 33, a second tank 7 connected to the high pressure pump 2 through second inflow side water system piping 6, a second inflow side on/off valve 31, and a second tank on/off valve 36, first outflow side water system piping 8 and second outflow side water system piping 9 respectively connected to the first tank 5 and the second tank 7, first bypass piping 32 connecting the first inflow side water system piping 4 to the first outflow side water system piping 8 to bypass the first tank 5, second bypass piping 35 connecting the second inflow side water system piping 6 to the second outflow side water system piping 9 to bypass the second tank 7, and nozzle-system piping 10 and a nozzle 11 connected, in order, to the first outflow side water system piping 8 and the second outflow side water system piping 9. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007083363(A) 申请公布日期 2007.04.05
申请号 JP20050276902 申请日期 2005.09.22
申请人 TOWA CORP 发明人 TAKEHARA KATSUNAO;YOSHIDA MASAHARU;KITAGAWA YASUYUKI;KISHIMOTO KAZUYUKI;KATO SEIJI
分类号 B24C5/02;B24C7/00;B24C9/00 主分类号 B24C5/02
代理机构 代理人
主权项
地址