| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light-emitting device having a small restriction by wiring and a high flexibility in layout. <P>SOLUTION: The light-emitting device includes an LED chip 10; a packaging substrate 20 where the LED chip 10 is packaged; a frame 40 made of a transparent resin material for surrounding the LED chip 10 at the packaging surface side of the LED chip 10 in the packaging substrate; and a sealing section 50 that is formed by filling a transparent resin material to the inside of the frame, and seals the LED chip 10 and a bonding wire 14 connected to the LED chip. A lead pattern 23 that is electrically connected to the electrode of the LED chip 10 via the bonding wire 14 and is extended to the edge is formed on the surface of an insulating member 22 for composing the packaging substrate 20, and a junction section 23c having a through hole 23d for joining a lead wire 110 to the extended edge of the lead wire 23 by solder is provided. <P>COPYRIGHT: (C)2007,JPO&INPIT |
