| 摘要 |
PURPOSE:To enhance circuit integration density and to increase signal processing speeds by a method wherein flexible pipes are installed in a vacancy in presence between the integrated circuit mounting side of a circuit board and the surface, of a liquid-cooled jacket, opposite to the surface thereof in contact with integrated circuit packages. CONSTITUTION:Liquid-cooled jackets 3 are installed tight from above on a plurality of integrated circuit packages 2 installed on a circuit board 1. The liquid-cooled jackets 3 accommodated in a package frame 5 are connected to each other with flexible pipes 4. A cooling liquid enters a passage 7 segmented by a plurality of parallelly arranged fins 6 at an entrance 8, to flow as indicated by arrows. A pump is used to drive cooling liquid upward from the lower ends of the flexible pipes 4. No part of a pipe 4 is higher than the height H of a cooling jacket 3. With no protrusions in presence on the surfaces of a liquid-cooled jacket 3, a package 2 may be piled on a circuit board 1 mounted with liquid-cooled jackets 3. |
