| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting resin composition which can reduce a coefficient of thermal expansion without lowering moldability and characteristics required for a printed wiring board and a multilayer printed wiring board. SOLUTION: The composition contains a thermosetting resin and a clayey layered mineral. The interlayers of the clayey layered mineral are subjected to ion exchange with an organic modifying agent represented by formula (1). This weakens the interaction between the layers of the clayey layered mineral to accelerate exfoliation of each layer and makes it possible to uniformly disperse each layer in a nanometer order into the composition. Accordingly, even if the amount formulated of the clayey layered mineral is small, the thermal expansion coefficient can be reduced sufficiently without lowering the moldability and the characteristics required for the printed wiring board and multilayer printed wiring board. COPYRIGHT: (C)2005,JPO&NCIPI |
