发明名称 Heatsink
摘要 <p>Provided is a heatsink, including a cooling zone (Z) to contact an object (40) to be frozen and having microchannels (35) formed therein to define a plurality of fluid pathways, an inlet (A) through which a working fluid enters, a distributor (B), interposed between the inlet (A) and the cooling zone (Z), to uniformly distribute the working fluid introduced through the inlet (A) to the microchannels (35), an outlet (F) through which the working fluid, passing through the cooling zone (Z), exits, and a collector (E), interposed between the cooling zone (Z) and the outlet (F), to collect the working fluid passing through the microchannels (35).</p>
申请公布号 EP1770775(A2) 申请公布日期 2007.04.04
申请号 EP20060121220 申请日期 2006.09.25
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 PARK, HEE-SUNG;KIM, SUN-SOO
分类号 H01L23/473 主分类号 H01L23/473
代理机构 代理人
主权项
地址