| 摘要 |
To bond a protection substrate on an organic EL element formation substrate using a curable resin without generating air bubbles in the curable resin in order to prevent oxygen or water from entering into an organic EL layer in an organic EL device. The protection substrate is supported at a plurality of locations by a plurality of support members. While individually adjusting the relative position of the support members to the element formation substrate, both substrates are bonded using the curable resin. At this time, the positions of the support members are controlled such that the curable resin is spread according to a predetermined pattern. |
