| 摘要 |
A semiconductor device, a method for reducing power noise and a PCB(Printed Circuit Board) are provided to improve the performance of the device by reducing the power noise regardless of AC(Alternating Current) component and DC(Direct Current) component using an impedance circuit and an AC component preventer. A semiconductor device comprises a chip, a package, at least one or more impedance circuits, and an AC component preventer. The chip includes a plurality of first source voltage terminals and first ground voltage terminals. The package is used for packaging the chip. The package includes a plurality of second source voltage terminals and second ground voltage terminals corresponding to the first source voltage terminals and first ground voltage terminals. The impedance circuits(3) are installed between the second source voltage terminals and a ground voltage. The AC component preventer(5) is installed between the second source voltage terminals and the ground voltage to prevent an AC component from a source voltage. |
