发明名称 Flat heat pipe fabricating method for e.g. portable computer`s microprocessor, involves forming envelope using copper/aluminum, mounting air valve on opening, and pressing envelope so that part of envelope deforms and seals opening
摘要 #CMT# #/CMT# The method involves forming an envelope (3), with a cavity (33), using copper or aluminum. An opening (312) is formed on a plane surface (311), made on the envelope, to communicate with the cavity. An air valve with a through hole traversing a bell-shaped deformable part is mounted on the opening, where the part is surrounded by a suction ring. Air in the cavity is removed via the hole, and the cavity is filled with fluid via the hole. The envelope is pressed along a direction perpendicular to the surface (311) so that a part of the envelope extends, deforms and seals the opening. #CMT#USE : #/CMT# Used for fabricating a flat heat pipe that is utilized for conducting heat produced by a heat source such as a microprocessor of a portable computer, play-station type game console host or communication host, to a heat conductor. #CMT#ADVANTAGE : #/CMT# The air valve permits to maintain air-tightness of the envelope during the fabrication of the flat heat pipe. The envelope is formed using copper or aluminum in order to reduce the fabrication cost of the heat pipe and to improve the efficiency of the pipe. The method permits to obtain the heat pipe having an integrity not destroyed by a clamping mechanism implemented during the heat pipe fabrication process, thus increasing the life duration and quality of the heat pipe. #CMT#DESCRIPTION OF DRAWINGS : #/CMT# The drawing shows a lateral section of a flat heat pipe. 3 : Envelope 31, 32 : Components 33 : Cavity 311 : Plane surface 312 : Opening.
申请公布号 FR2891173(A1) 申请公布日期 2007.03.30
申请号 FR20050009843 申请日期 2005.09.27
申请人 ASIA VITAL COMPONENTS CO., LTD. 发明人 DING PEI PEI;YANG HSIU WEI;LIN JAO CHING;YU WEN HWA;CHEN YEN WEN
分类号 B23P15/26;F28D15/04;G06F1/20 主分类号 B23P15/26
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