| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photodetector module capable of supporting reduction in size of an electronic machine, high density packaging and variation in forms. <P>SOLUTION: The photodetector module A includes a light receiving element 2 and an integrated circuit element 3 for controlling the element 2. It further includes a flexible wiring board 1 having the elements 2 and 3 mounted and having an easily deformable region specified between the light receiving element 2 and the integrated circuit element 3. <P>COPYRIGHT: (C)2007,JPO&INPIT |
