| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition having good latent curability and fluidity and to provide a semiconductor device having excellent reliability. SOLUTION: The epoxy resin composition comprises a compound represented by general formula (1) [wherein, X represents an organic group], a silane compound represented by ZSi(OR)<SB>3</SB>(wherein, Z represents an organic group having a substituted or an unsubstituted aromatic ring or a heterocycle or a substituted or an unsubstituted aliphatic group; and R represents a 1-3C aliphatic group) and a curing accelerator. The epoxy resin composition is characterized in that the compound represented by general formula (1), silane compound and curing accelerator are melt mixed under reduced pressure. COPYRIGHT: (C)2007,JPO&INPIT
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