| 摘要 |
In a substrate processing apparatus of the present invention, when substrates are loaded into a chamber, a frame part formed integral with a substrate holding part is interposed between the chamber and a cover, thereby sealing the interior of the chamber. When the substrates are unloaded to above the chamber, the chamber and the cover are brought into a direct contact, thereby sealing the interior of the chamber. Hence, the interior of the chamber can be sealed satisfactorily when the substrates are loaded into the chamber, and when the substrates are unloaded to above the chamber.
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