EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR, AND SEMICONDUCTOR DEVICE BY USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing a semiconductor, reducing the generation of warpage and also excellent in flame retardant property and solder resistance. SOLUTION: This epoxy resin composition for sealing the semiconductor comprises the following (A) component, a phenol resin and at least one kind of a metal hydroxide selected from a group consisting of aluminum hydroxide and magnesium hydroxide. (A) The epoxy resin consists mainly of an epoxy resin expressed by structural formula (1). COPYRIGHT: (C)2007,JPO&INPIT