| 摘要 |
PROBLEM TO BE SOLVED: To provide a flexible circuit substrate where sufficient adhesion is obtained between a polyimide layer and a conductor layer after a circuit is formed, and adhesion deterioration after thermal load can be reduced as much as possible. SOLUTION: In the flexible circuit substrate, a carbon layer is laminated on a surface of a substrate film formed of polymeric resin such as a polyimide film, a metal layer is laminated on the surface of the carbon layer, and a copper conductive layer is laminated on the surface of the metal layer. The circuit substrate is used for an electronic apparatus. COPYRIGHT: (C)2007,JPO&INPIT
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