| 摘要 |
A manufacturing process of the invention by the use of warm lamination methodto adhere to an IC card having multi electronic componentsis disclosed. The invention mainly intends to prevent the built-in multi electronic components of the IC card from being damaged during the thermal pressing process. In the meantime, the invention can improve yield as well as complete the adhesion of the IC card under the condition having using only the IC card's pressing facility already have that can conform the conditions of the present manufacturing process without affecting the capacity of the production scale. The steps of the manufacturing process are as follows. (I). printing beforehand the upper layer and lower layer of the main body into the required panel in accordance with demands. (II). depending on the requirements, milling hole beforehand for the upper layer of the IC card's main body in accordance with the relative location of the multi electronic components of the built-in IC chip etc. of the central filling layer. (III). applying beforehand coating with glue on the adhesion surface portion between the upper and lower layers of the IC card's main body. (IV). pressing and heating the layers of the IC cards by the use of the plate of the layer pressing machine up to a temperature between 50-80° C. and a pressure between 2-8 mpa (mega pascal) to make the upper, lower, and central layers adhere together. (V). after finishing pressing and adhering, taking the IC card's main body out from the pressing machine, and performing punching and cutting into the required size of IC cards so as to complete the manufacturing of an IC card having multi electronic components.
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