SEMICONDUCTOR STACKED DIE/WAFER CONFIGURATION AND PACKAGING AND METHOD THEREOF
摘要
<p>A reciprocal design symmetry allows stacked wafers (120, 122) or die (154) on wafer to use identical designs or designs that vary only by a few layers (e.g. metal interconnect layers). Flipping or rotating one die or wafer allows the stacked die to have a reciprocal orientation with respect to each other which may be used to decrease the interconnect (270-279, 89-80) required between the vertically stacked die and or wafers. Flipping and/or rotating may also be used to improve heat dissipation when wafer and/or die are stacked. The stacked wafers or die may then be packaged.</p>
申请公布号
WO2007035234(A2)
申请公布日期
2007.03.29
申请号
WO2006US34319
申请日期
2006.08.30
申请人
FREESCALE SEMICONDUCTOR;POZDER, SCOTT, K.;ALAM, SYED, M.;JONES, ROBERT, E.
发明人
POZDER, SCOTT, K.;ALAM, SYED, M.;JONES, ROBERT, E.