发明名称 METHOD OF MANUFACTURING MULTILAYER SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer substrate reduced in adhesion defect. SOLUTION: In a chamber 10, an adhesive material 5 is attached to a first ferrite substrate 2 and pressure is reduced. Since the pressure is reduced before adhering a second ferrite substrate 4, an air bubble is deaerated from the sufficiently exposed adhesive material 5. After the pressure is reduced, the pressure in the chamber 10 is boosted to air pressure lower than the atmospheric pressure. Thus, the volume of the air bubble remaining in the adhesive material 5 is reduced according to a Boyle Charle's law. The air bubble whose volume is reduced float on the surface of the adhesive material 5 and is diffused. After boosting, the first ferrite substrate 2 and the second ferrite substrate 4 are adhered through the adhesive material 5 and the chamber 10 is boosted to the atmospheric pressure. Thus, the volume of the air bubble mixed in the adhesive material 5 during adhesion is reduced according to the Boyle Charle's law. The air bubble whose volume is reduced is diffused from the surface of the adhesive material 5. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007081236(A) 申请公布日期 2007.03.29
申请号 JP20050268905 申请日期 2005.09.15
申请人 TDK CORP 发明人 SOMA IZURU;KUMAGAI MASARU;OKUBO HITOSHI;MORITA MAKOTO;ITO TOMOKAZU
分类号 H05K3/46 主分类号 H05K3/46
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