| 摘要 |
PROBLEM TO BE SOLVED: To reduce a deformation of a bonding wire by a pressure at the time of sealing with resin and prevent contact failures between the bonding wires. SOLUTION: A semiconductor device is equipped with a base substrate 2, and a semiconductor chip 1 wherein the semiconductor chip 1 and the base substrate 2 are electrically connected by a bonding wire 4, and furthermore the semiconductor chip 1 and the bonding wire 4 are sealed with a resin layer 7. On a front surface of the semiconductor chip 1, there is provided a rigid support 9 in which a bonding layer 8 is formed for holding at least one of the bonding wire 4. COPYRIGHT: (C)2007,JPO&INPIT
|
