| 摘要 |
PROBLEM TO BE SOLVED: To provide a reactive hot melt adhesive which does not cause generation of a gas on curing reaction, reaches the final strength in a short time, and has good adhesiveness to a wide range of adherends. SOLUTION: The active energy ray curable hot melt adhesive comprises a diene (co)polymer (A), a vinyl group-containing component (B), an active energy ray polymerization initiator (C), and a tackifying resin (D), and particularly the component (A) is at least one kind selected from the group consisting of a styrene-butadiene-styrene block copolymer rubber (SBS), a styrene-isoprene-styrene block copolymer rubber (SIS), and a partially hydrogenated product thereof. COPYRIGHT: (C)2007,JPO&INPIT
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