| 摘要 |
A light emitting diode with high heat dissipation includes a substrate, a LED chip, a metal light reflection layer, a first lens, a holder, and a second lens. The substrate has an upper surface formed with a positive electrode and an opposite electrode, and a lower surface opposite to the upper surface. The LED chip is arranged on the upper surface of the substrate, and is electrically connected to the positive electrode and the opposite electrode by wires. The metal light reflection layer is located on the upper surface of the substrate for surrounding the LED chip, and reflecting the light emitted from the LED chip. The first lens is mounted on the metal light reflection layer for encapsulating the LED chip. The holder is mounted on the substrate to cover the first lens. And the second lens arranged on the holder.
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