METHOD FOR INTERCONNECTING MICROSTRIP BOARDS

摘要

FIELD: radio-electronic engineering including radio equipment manufacture. ^ SUBSTANCE: proposed method for interconnecting microstrip boards includes their mechanical junction, filling of gaps formed in the process with composition incorporating grade B silicone rubber, catalyst K 68, and capacitor titanium dioxide followed by exposure of joined microstrip boards to room temperature for minimum 2 h. ^ EFFECT: reduced microwave energy loss and standing wave ratio at junction point of microstrip boards. ^ 1 cl, 2 tbl