| 摘要 |
An apparatus for manufacturing a semiconductor device is provided to minimize the surface damage of a substrate and to improve process yield by performing a pumping process on the surface of the substrate. An apparatus for manufacturing a semiconductor device comprises a process chamber, a chuck(210) for loading a semiconductor substrate(200), a pumping exhaust port(230), and an exhaust plate(240) located at the upper and the lower of the pumping exhaust port for forming exhaust path to the lower of the chamber. The pumping exhaust port is located on the upper part of the substrate for exhausting particles and reaction gases in the chamber.
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