| 摘要 |
A printed circuit board using a conductive dry film and a method for manufacturing the same are provided to simplify a manufacturing process and lighten the printed circuit board by stacking the conductive dry film on an insulation layer and forming a circuit pattern through a developing process. A printed circuit board using a conductive dry film includes an insulation layer(110), and the conductive dry film. A predetermined circuit pattern(170) is formed on at least one plane of the insulation layer(110). The circuit pattern(170) is formed by using the conductive dry film. The conductive dry film is formed by stacking an ACF(Anisotropic Conductive Film) on the dry film. The ACF includes a plurality of conductive particles which are separated inside. If heat and pressure are applied when the ACF is stacked on the dry film, the conductive particles are contacted with each other.
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