| 摘要 |
PROBLEM TO BE SOLVED: To suppress occurrence of temperature nonuniformity between the upside and downside of a sample vessel 2 mounted to a rack 51 in a sample cooling device. SOLUTION: The sample cooling device comprises a hole 2 formed in the rack 51 made of a heat transfer member and an insulative member (disk 35) laid on the bottom of the hole. The upper part of a side wall of the sample vessel 2 mounted to the rack 51 thermally comes into contact with the heat transfer member, and the bottom of the sample vessel 2 abuts on the insulative member. The hole diameter close to the bottom of the vessel is set larger than the hole diameter of the upper part. The sample vessel 2 is cooled mainly by heat transfer from the upper part of the side surface, and is not rapidly cooled from the bottom surface. Therefore, solution in the sample vessel 2 convects to suppress occurrence of temperature nonuniformity between the upside and downside. COPYRIGHT: (C)2007,JPO&INPIT
|
