| 摘要 |
PROBLEM TO BE SOLVED: To withstand the vibrations of an ultrasonic wave bonder by the hardness of a member where a second P electrode is formed, to prevent the peeling of a P-electrode at a wire junction part, to prevent light leakage from the part, and to display an extremely good effect in the improvement of printing quality or the like. SOLUTION: For this LED array 1, the P-electrode is composed of a first P-electrode 4 by Au or the like laid on the surface of an LED substrate, excluding the part of a light-emitting window 4a, and a second P-electrode 5 by Ti or the like of at least one layer laid on the surface of the LED substrate 2, excluding the part of the light emitting window 4a and a section part 2e, and cutting by a dicer is performed, including the first P electrode 4 within the range of the section part 2e. Thus, the vibration of the ultrasonic wave bonder can be withstood by a member where the second P-electrode 5 is formed, and by providing no second P-electrode 5 in a cut corresponding part, only the first P-electrode 4 is cut at the time of cutting by the dicer and also chipping is not generated. |
