| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of thinning a substrate which can reduce transfer of a groove trace of a support plate onto a substrate, and can reduce the generation of cutting unevenness on the substrate, and to provide a method of manufacturing a circuit element. SOLUTION: The surface of a support plate 1 integrated with a semiconductor wafer W by an adhesive 2 where a sheet 6 is pasted is placed on the top surface of a suction head 7, and is sucked and fixed. Then, the top surface of the semiconductor wafer W (surface where a circuit is not formed) is ground in this state by a grinder 8. COPYRIGHT: (C)2007,JPO&INPIT
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