| 摘要 |
The present invention comprises an apparatus for manufacturing a sputtering target that has a crucible for holding a liquid material. The crucible has a discharge opening. A positioning mechanism is mounted adjacent the crucible. A substrate is held by the positioning mechanism. The positioning mechanism moves the substrate such that the material is deposited onto the substrate. A method of manufacturing a sputtering target is also disclosed. The method includes melting an material and discharging the material through a nozzle. A substrate is moved adjacent the nozzle such that the material is deposited onto the substrate.
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